#ifndef  ENTITY_SDAIPHYSICAL_CONNECTIVITY_LAYOUT_TOPOLOGY_REQUIREMENT_ASSIGNMENT_H
#define  ENTITY_SDAIPHYSICAL_CONNECTIVITY_LAYOUT_TOPOLOGY_REQUIREMENT_ASSIGNMENT_H

// This file was generated by exp2cxx,
// 0.8.1.
// You probably don't want to edit it since your modifications
// will be lost if exp2cxx is used to regenerate it.

class SC_SCHEMA_EXPORT SdaiPhysical_connectivity_layout_topology_requirement_assignment : public SdaiRequirement_assignment {
     protected:
    public: 
        SdaiPhysical_connectivity_layout_topology_requirement_assignment();
        SdaiPhysical_connectivity_layout_topology_requirement_assignment( SDAI_Application_instance *se, bool addAttrs = true );
        SdaiPhysical_connectivity_layout_topology_requirement_assignment( SdaiPhysical_connectivity_layout_topology_requirement_assignment & e );
        ~SdaiPhysical_connectivity_layout_topology_requirement_assignment();
        int opcode() {
            return 1841;
        }
};

inline SdaiPhysical_connectivity_layout_topology_requirement_assignment * create_SdaiPhysical_connectivity_layout_topology_requirement_assignment() {
    return new SdaiPhysical_connectivity_layout_topology_requirement_assignment;
}

void init_SdaiPhysical_connectivity_layout_topology_requirement_assignment(Registry& reg);

namespace ap210_electronic_assembly_interconnect_and_packaging_design_mim_lf {
    extern EntityDescriptor *e_physical_connectivity_layout_topology_requirement_assignment;
}

#endif
